Government Shifts Semicon Mission 2.0 Toward Memory Chips

Building on the foundational success of the nation’s semiconductor journey, the central government has officially launched

This next phase marks a decisive strategic pivot for the country; it moves beyond basic assembly to prioritize high-value, advanced memory packaging. A central pillar of this mission is the targeted development of High Bandwidth Memory (HBM), positioning India as a key player in the global high-performance computing and AI supply chains.

Evolution from ISM 1.0 to 2.0

While the first phase of the mission (launched in 2021) was instrumental in establishing the groundwork for semiconductor manufacturing, packaging, and design, ISM 2.0 aims to deepen India’s technological footprint. The government has proposed a massive financial outlay, with reports suggesting a scale-up to approximately ₹1.2 lakh crore to support this second phase.

Source: – www.bisinfotech.com